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晶圆厚度/非接触电阻率测试仪MX608
Thickness :Capacitive Sensors(电容探头)Resistivity :Eddy Current Principle(涡流探头)Dopant :Type Surface Photo Voltage System(表面光电压法)MX 608晶圆尺寸Wafer Size:100/125/150/200mm厚度Thickness :500-800?m(300-600?m可选)电阻率Resistivity:0.001 – 200 Ohm·cmMX6012晶圆尺寸Wafer Size:200/300mm厚度Thickness :600-900?m电阻率Resistivity:0.001 –···